Molded Guide
www.vishay.com
SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the Leadframe.
Molded Chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
Vishay Sprague
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified. ?
MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT 893D/TF3/T86
Epoxy
S ilver
Encap s ulation
Adhe s ive
Anode
Polarity Bar
MnO 2 /Carbon/
S ilver Coating
S olderable
Cathode
Termination
Leadframe
S intered
Tantalum
S olderable Anode
Termination
MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPES 893D/TF3/T86
Epoxy Encap s ulation
S ilver Adhe s ive
S olderable Cathode
Termination
MnO 2 /Carbon/ S ilver
Coating
S intered Tantalum
Pellet
Fu s ible
Wire
Anode Polarity Bar
S olderable
Lead Frame
Anode Termination
Revision: 03-Feb-14
2
Document Number: 40074
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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